The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Jun. 23, 2017
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Koji Maeda, Tokyo, JP;

Hiroshi Shimomoto, Tokyo, JP;

Kuniaki Yamaguchi, Tokyo, JP;

Hiroshi Aono, Tokyo, JP;

Tetsuya Yashima, Tokyo, JP;

Hidetatsu Isokawa, Tokyo, JP;

Kenji Shinkai, Tokyo, JP;

Mitsuhiko Inaba, Tokyo, JP;

Koichi Hashimoto, Tokyo, JP;

Junji Kunisawa, Tokyo, JP;

Mitsuru Miyazaki, Tokyo, JP;

Fujihiko Toyomasu, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02096 (2013.01); H01L 21/0201 (2013.01); H01L 21/02068 (2013.01); H01L 21/02046 (2013.01); H01L 21/02076 (2013.01); H01L 21/02085 (2013.01); H01L 21/02087 (2013.01);
Abstract

The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.


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