The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Jul. 14, 2015
Applicant:

Basf SE, Ludwigshafen, DE;

Inventors:

Robert Reichardt, Ludwigshafen am Rhein, DE;

Max Siebert, Ludwigshafen, DE;

Yongqing Lan, Ludwigshafen, DE;

Michael Lauter, Mannheim, DE;

Haci Osman Guevenc, Heidelberg, DE;

Julian Proelss, Worms, DE;

Sheik Ansar Usman Ibrahim, Heverlee, BE;

Reza Golzarian, Portland, OR (US);

Assignee:

BASF SE, Ludwigshafen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/04 (2006.01);
U.S. Cl.
CPC ...
C09G 1/04 (2013.01);
Abstract

A chemical mechanical polishing (CMP) composition (Q) comprising (A) Colloidal or fumed inorganic particles (A) or a mixture thereof in a total amount of from 0.0001 to 2.5 wt.-% based on the total weight of the respective CMP composition (B) at least one amino acid in a total amount of from 0.2 to 1 wt.-% based on the total weight of the respective CMP composition (C) at least one corrosion inhibitor in a total amount of from 0.001 to 0.02 wt.-% based on the total weight of the respective CMP composition (D) hydrogen peroxide as oxidizing agent in a total amount of from 0.0001 to 2 wt.-% based on the total amount of the respective CMP composition (E) aqueous medium wherein the CMP composition (Q) has a pH in the range of from 6 to 9.5.


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