The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Jun. 01, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kuo-Hua Pan, Hsinchu, TW;

Je-Wei Hsu, Hsinchu, TW;

Hua Feng Chen, Hsinchu, TW;

Jyun-Ming Lin, Hsinchu, TW;

Chen-Huang Peng, Hsinchu, TW;

Min-Yann Hsieh, Kaohsiung, TW;

Java Wu, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 29/78 (2006.01); H01L 29/45 (2006.01); H01L 29/417 (2006.01); H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
H01L 29/665 (2013.01); H01L 21/31144 (2013.01); H01L 21/76831 (2013.01); H01L 23/485 (2013.01); H01L 29/0847 (2013.01); H01L 29/41791 (2013.01); H01L 29/45 (2013.01); H01L 29/6656 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01); H01L 21/28518 (2013.01);
Abstract

A method includes forming a transistor, which includes forming a dummy gate stack over a semiconductor region, and forming an Inter-Layer Dielectric (ILD). The dummy gate stack is in the ILD, and the ILD covers a source/drain region in the semiconductor region. The method further includes removing the dummy gate stack to form a trench in the first ILD, forming a low-k gate spacer in the trench, forming a replacement gate dielectric extending into the trench, forming a metal layer to fill the trench, and performing a planarization to remove excess portions of the replacement gate dielectric and the metal layer to form a gate dielectric and a metal gate, respectively. A source region and a drain region are then formed on opposite sides of the metal gate.


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