The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Sep. 05, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Fong-Yuan Chang, Hsinchu County, TW;
Kuo-Nan Yang, Hsinchu, TW;
Chung-Hsing Wang, Hsinchu County, TW;
Lee-Chung Lu, Taipei, TW;
Sheng-Fong Chen, Hsinchu County, TW;
Po-Hsiang Huang, Tainan, TW;
Hiranmay Biswas, Kolkata, IN;
Sheng-Hsiung Chen, Hsinchu County, TW;
Aftab Alam Khan, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
An integrated circuit includes a cell layer, a first metal layer, and a first conductive via. The cell layer includes first and second cells, each of which is configured to perform a circuit function. The first metal layer is above the cell layer and includes a first conductive feature that extends from the first cell into the second cell and that is configured to receive a supply voltage. A first conductive via interconnects the cell layer and the metal layer.