The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Jun. 10, 2015
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Hucheng Lee, Cupertino, CA (US);

Lisheng Gao, Morgan Hill, CA (US);

Govindarajan Thattaisundaram, San Jose, CA (US);

Assignee:

KLA—Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G05B 2219/32196 (2013.01); G05B 2219/32222 (2013.01); G05B 2219/37224 (2013.01); Y02P 90/20 (2015.11); Y02P 90/22 (2015.11);
Abstract

Systems and methods for monitoring stability of a wafer inspection recipe over time are provided. One method includes collecting inspection results over time. The inspection results are generated by at least one wafer inspection tool while performing the wafer inspection recipe on wafers at different points in time. The method also includes identifying abnormal variation in the inspection results by comparing the inspection results generated at different times to each other. In addition, the method includes determining if the abnormal variation is attributable to the wafers, the wafer inspection recipe, or one or more of the at least one wafer inspection tool thereby determining if the wafer inspection recipe is stable over time.


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