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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10504865 B1

PDFFull Text
Date of Patent:
Dec. 10, 2019

Filed:

Sep. 28, 2017

Package structure and method of manufacturing the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Ming-Kai Liu, Hsinchu, TW;

Han-Ping Pu, Taichung, TW;

Ting-Chu Ko, Hsinchu, TW;

Yung-Ping Chiang, Hsinchu County, TW;

Chang-Wen Huang, Hsinchu, TW;

Yu-Sheng Hsieh, New Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, JP;

Attorney:

JCIPRNET

Primary Examiner:

Nathan W Ha

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/25 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 25/105 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/24101 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/25174 (2013.01); H01L 2224/25175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Provided is a package structure includes a die having a first connector, a RDL structure disposed on the die, and a second connector. The RDL structure includes at least one elongated via located on and connected to the first connector. The second connector is disposed on and connected to the RDL structure.

Find Patent Forward Citations

Liu, Ming-Kai. (2019). Package structure and method of manufacturing the same (U.S. Patent No. 10504865). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10504865

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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