The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Oct. 25, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Shih-Han Huang, Kaohsiung, TW;

Ching-Chun Wang, Tainan, TW;

Dun-Nian Yaung, Taipei, TW;

Hsing-Chih Lin, Tainan, TW;

Jen-Cheng Liu, Hsin-Chu, TW;

Min-Feng Kao, Chiayi, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/822 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 27/08 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/8221 (2013.01); H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H01L 21/76877 (2013.01); H01L 24/74 (2013.01); H01L 27/08 (2013.01); H01L 28/10 (2013.01); H01F 2017/002 (2013.01); H01F 2017/004 (2013.01); H01F 2017/0086 (2013.01);
Abstract

The present disclosure, in some embodiments, relates to an integrated circuit having an inductor with one or more turns arranged along vertical planes that intersect an underlying substrate. In some embodiments, the integrated circuit includes a plurality of conductive routing layers having conductive wires and conductive vias disposed within one or more dielectric structures abutting a first substrate. The plurality of conductive routing layers define an inductor having one or more turns respectively including a vertically extending segment arranged along a plane that intersects the first substrate. The vertically extending segment has a plurality of the conductive wires and the conductive vias.


Find Patent Forward Citations

Huang, Shih-Han. (2019). Inductor structure for integrated circuit (U.S. Patent No. 10504784). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10504784

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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