The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Dec. 11, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yu-Hung Lin, Taichung, TW;
Sheng-Hsuan Lin, Zhubei, TW;
Chih-Wei Chang, Hsinchu, TW;
You-Hua Chou, Hsinchu, TW;
Chia-Lin Hsu, Tainan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01); H01L 23/522 (2006.01); H01L 23/485 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76847 (2013.01); H01L 21/28518 (2013.01); H01L 21/76802 (2013.01); H01L 21/76828 (2013.01); H01L 21/76843 (2013.01); H01L 21/76846 (2013.01); H01L 21/76855 (2013.01); H01L 23/485 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01); H01L 23/481 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An embodiment contact plug includes a bilayer structure and a diffusion barrier layer on a sidewall and a bottom surface of the bilayer structure. The bilayer structure includes a conductive core and a conductive liner on a sidewall and a bottom surface of the conductive core. In the embodiment contact plug, the conductive liner comprises cobalt or ruthenium.