The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Nov. 16, 2017
Applicants:

Global Unichip Corporation, Hsinchu, TW;

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chih-Chieh Liao, Hsinchu, TW;

Yu-Min Sun, Hsinchu, TW;

Chih-Feng Cheng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 31/28 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); G01R 31/2875 (2013.01); H01L 21/673 (2013.01); H01L 21/67017 (2013.01); H01L 21/67248 (2013.01); H01L 21/6838 (2013.01);
Abstract

A carrying device includes a main body, a grasping portion, a heat-exchanging module and a gas chamber device. The grasping portion is connected to the main body for grasping a semiconductor element. The heat-exchanging module is disposed on the main body. The gas chamber device includes a case body and a gas. The case body is disposed between the grasping portion and the heat-exchanging module, and has a closed chamber therein. The gas fills the closed chamber for transferring heat from the semiconductor element to the heat exchanging module, in which a specific heat capacity of the gas is about between 5000 J/(kg·K)-15000 J/(kg·K).


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