The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Apr. 29, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jasmeet S. Chawla, Hillsboro, OR (US);

Rami Hourani, Portland, OR (US);

Mauro J. Kobrinsky, Portland, OR (US);

Florian Gstrein, Portland, OR (US);

Scott B. Clendenning, Portland, OR (US);

Jeanette M. Roberts, North Plains, OR (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76834 (2013.01); H01L 21/76814 (2013.01); H01L 21/76819 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01); H01L 2221/101 (2013.01); H01L 2221/1063 (2013.01);
Abstract

A conductive route structure may be formed comprising a conductive trace and a conductive via, wherein the conductive via directly contacts the conductive trace. In one embodiment, the conductive route structure may be formed by forming a dielectric material layer on the conductive trace. A via opening may be formed through the dielectric material layer to expose a portion of the conductive trace and a blocking layer may be from only on the exposed portion of the conductive trace. A barrier line may be formed on sidewalls of the via opening and the blocking layer may thereafter be removed. A conductive via may then be formed within the via opening, wherein the conductive via directly contacts the conductive trace.


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