The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Dec. 18, 2015
Applicant:
Intel Ip Corporation, Santa Clara, CA (US);
Inventors:
Christian Geissler, Teugn, DE;
Sven Albers, Regensburg, DE;
Georg Seidemann, Landshut, DE;
Andreas Wolter, Regensburg, DE;
Klaus Reingruber, Langquaid, DE;
Thomas Wagner, Regelsbach, DE;
Marc Dittes, Regensburg, DE;
Assignee:
Intel IP Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4889 (2013.01); H01L 21/4896 (2013.01); H01L 23/48 (2013.01); H01L 23/538 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/065 (2013.01); H01L 25/0652 (2013.01); H05K 1/185 (2013.01); H05K 3/4046 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/19 (2013.01); H01L 2224/20 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/85186 (2013.01); H01L 2924/181 (2013.01); H05K 3/007 (2013.01); H05K 3/4644 (2013.01); H05K 2201/10287 (2013.01);
Abstract
A method includes aligning a wire with a package body having a contact pad and moving the wire through the package body to form electrical contact with the contact pad.