The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Jan. 29, 2018
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Anatoly Romanovsky, Palo Alto, CA (US);

Ivan Maleev, Pleasanton, CA (US);

Daniel Kavaldjiev, San Jose, CA (US);

Yury Yuditsky, Mountain View, CA (US);

Dirk Woll, San Jose, CA (US);

Stephen Biellak, Sunnyvale, CA (US);

Mehdi Vaez-Iravani, Los Gatos, CA (US);

Guoheng Zhao, Palo Alto, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01N 21/88 (2006.01); G01N 21/47 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/47 (2013.01); G01N 21/8806 (2013.01); G01N 21/8851 (2013.01); G01N 21/956 (2013.01);
Abstract

Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.


Find Patent Forward Citations

Loading…