The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Oct. 13, 2016
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Shingo Togashi, Tokyo, JP;

Hozumi Yasuda, Tokyo, JP;

Makoto Fukushima, Tokyo, JP;

Osamu Nabeya, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/32 (2012.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 37/32 (2013.01); B24B 37/20 (2013.01);
Abstract

Provided is a substrate holding device used in a substrate polishing apparatus that polishes a substrate using a polishing pad. The substrate holding device includes: a retainer ring configured to hold a peripheral edge of the substrate; and a drive ring fixed to the retainer ring so as to rotate together with the retainer ring. The surface of the retainer ring at the polishing pad side has a convex portion at a position other than an innermost circumference following a shape of the drive ring.


Find Patent Forward Citations

Togashi, Shingo. (2019). Substrate holding device, and substrate polishing apparatus (U.S. Patent No. 10486284). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10486284

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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