The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Oct. 21, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

John Hench, Los Gatos, CA (US);

Antonio Gellineau, Santa Clara, CA (US);

Nikolay Artemiev, Berkeley, CA (US);

Joseph A. Di Regolo, Livermore, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 23/20 (2018.01); G01N 23/201 (2018.01); G01N 23/083 (2018.01); G21K 1/06 (2006.01);
U.S. Cl.
CPC ...
G01N 23/201 (2013.01); G01N 23/083 (2013.01); G01N 23/20083 (2013.01); G01N 2223/054 (2013.01); G01N 2223/303 (2013.01); G21K 1/067 (2013.01);
Abstract

Methods and systems for calibrating the location of x-ray beam incidence onto a specimen in an x-ray scatterometry metrology system are described herein. The precise location of incidence of the illumination beam on the surface of the wafer is determined based on occlusion of the illumination beam by two or more occlusion elements. The center of the illumination beam is determined based on measured values of transmitted flux and a model of the interaction of the beam with each occlusion element. The position of the axis of rotation orienting a wafer over a range of angles of incidence is adjusted to align with the surface of wafer and intersect the illumination beam at the measurement location. A precise offset value between the normal angle of incidence of the illumination beam relative to the wafer surface and the zero angle of incidence as measured by the specimen positioning system is determined.


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