The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
May. 04, 2017
Applicant:
Globalwafers Co., Ltd., Hsinchu, TW;
Inventors:
Chun-I Fan, Hsinchu, TW;
Chih-Yuan Chuang, Hsinchu, TW;
Ying-Ru Shih, Hsinchu, TW;
Wen-Ching Hsu, Hsinchu, TW;
Assignee:
GlobalWafers Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 29/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02021 (2013.01); H01L 21/265 (2013.01); H01L 21/324 (2013.01); H01L 29/32 (2013.01);
Abstract
A semiconductor substrate and a manufacturing method thereof are provided. The semiconductor substrate has an epitaxy region located at a central portion of a main plane of the semiconductor substrate, a periphery region surrounding the epitaxy region and an injured region distributed inside the periphery region.