The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Jun. 06, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Ming-Hong Cha, Hsinchu, TW;
Chen-Shien Chen, Zhubei, TW;
Chen-Cheng Kuo, Chu-Pei, TW;
Tsung-Hsien Chiang, Hsinchu, TW;
Hao-Juin Liu, Kaohsiung, TW;
Yao-Chun Chuang, Hsinchu, TW;
Chita Chuang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.