The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Sep. 18, 2017
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chi-Yang Yu, Taoyuan County, TW;
Chien-Kuo Chang, Hsinchu County, TW;
Chih-Hao Lin, Hsinchu, TW;
Jung Tsung Cheng, Hsinchu, TW;
Kuan-Lin Ho, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface, a first sidewall substantially orthogonal to the first surface and the second surface; an isolation layer surrounding and contacted with the first sidewall of the substrate; a die disposed over the second surface of the substrate; a first conductive bump disposed at the first surface of the substrate; and a second conductive bump disposed between the substrate and the die.