The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Mar. 10, 2017
Applied Materials, Inc., Santa Clara, CA (US);
Eric Lau, Santa Clara, CA (US);
Hui Chen, Burlingame, CA (US);
King Yi Heung, Union City, CA (US);
Wei-Cheng Lee, Los Altos Hills, CA (US);
Chih Chung Chou, San Jose, CA (US);
Edwin C. Suarez, Fremont, CA (US);
Garrett Ho Yee Sin, San Jose, CA (US);
Charles C. Garretson, Sunnyvale, CA (US);
Jeonghoon Oh, Saratoga, CA (US);
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.