Company Filing History:
Years Active: 2019-2023
Title: Innovations of Wei-Cheng Lee
Introduction
Wei-Cheng Lee is a notable inventor based in Los Altos Hills, California. He has made significant contributions to the field of semiconductor manufacturing, particularly in chemical mechanical polishing (CMP) technology. With a total of three patents to his name, Lee's work has had a substantial impact on the industry.
Latest Patents
Wei-Cheng Lee's latest patents include innovative designs that enhance the efficiency and effectiveness of polishing processes. One of his patents is for a retaining ring for CMP, which features a generally annular body designed to constrain a substrate. This retaining ring includes a bottom surface with multiple channels that extend from the outer surface to the inner surface, along with islands that provide contact areas for polishing pads. Each channel is designed with a recessed region that allows for deeper polishing, ensuring a uniform depth throughout. Another significant patent involves a local area polishing system and polishing pad assemblies, which include a chuck with a substrate receiving surface and multiple polishing pad assemblies. These assemblies are capable of movement in various directions, optimizing the polishing process.
Career Highlights
Wei-Cheng Lee is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His work at Applied Materials has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in polishing technology.
Collaborations
Some of Wei-Cheng Lee's coworkers include Jeonghoon Oh and Andrew J Nagengast. Their collaborative efforts have further propelled innovations in the field, enhancing the capabilities of polishing systems.
Conclusion
Wei-Cheng Lee's contributions to the semiconductor industry through his patents and work at Applied Materials, Inc. highlight his role as a key innovator in CMP technology. His inventions continue to influence the efficiency of semiconductor manufacturing processes.