The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Jan. 05, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kyu-Oh Lee, Chandler, AZ (US);

Islam A. Salama, Scottsdale, AZ (US);

Ram S. Viswanath, Phoenix, AZ (US);

Robert L. Sankman, Phoenix, AZ (US);

Babak Sabi, Hillsboro, OR (US);

Sri Chaitra Jyotsna Chavali, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/48 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/13 (2013.01); H01L 23/48 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); H01L 25/105 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1088 (2013.01); H01L 2924/15311 (2013.01);
Abstract

An integrated circuit (IC) structure includes a first IC package (ICP), including a first resist surface provided with a first plurality of conductive contacts (CCs), a first recess including a second resist surface disposed at a bottom of the recess and having a second plurality of CCs, and a second recess, including a third resist surface disposed at a bottom of the recess and provided with a fourth plurality of CCs. The IC structure further includes an IC component with a first surface and a second surface, the second surface having a third plurality of CCs coupled to the second plurality of CCs of the first ICP. The IC structure further includes a second ICP having a first surface and a second surface, with one or more CCs located at the second surface and coupled to at least one of the first plurality of CCs of the first ICP.


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