The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Aug. 17, 2017
Micromaterials Llc, Wilmington, DE (US);
Ying Zhang, Santa Clara, CA (US);
Abhijit Basu Mallick, Palo Alto, CA (US);
Regina Freed, Los Altos, CA (US);
Nitin K. Ingle, Santa Clara, CA (US);
Uday Mitra, Cupertino, CA (US);
Ho-yung Hwang, Cupertino, CA (US);
Mirocmaterials LLC, Wilmington, DE (US);
Abstract
A first metallization layer comprising a set of first conductive lines that extend along a first direction on a first insulating layer on a substrate. A second insulating layer is on the first insulating layer. A second metallization layer comprises a set of second conductive lines on a third insulating layer and on the second insulating layer above the first metallization layer. The set of second conductive lines extend along a second direction that crosses the first direction at an angle. A via between the first metallization layer and the second metallization layer. The via is self-aligned along the second direction to one of the first conductive lines.