The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Nov. 20, 2015
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Laurent Karsenti, Rehovot, IL;

Kris Bhaskar, San Jose, CA (US);

Mark Wagner, Rehovot, IL;

Brian Duffy, San Jose, CA (US);

Vijayakumar Ramachandran, Sunnyvale, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 1/00 (2006.01); G06T 7/00 (2017.01); H04N 7/18 (2006.01); H04L 29/08 (2006.01); G06F 16/9535 (2019.01);
U.S. Cl.
CPC ...
G06F 16/9535 (2019.01); G06T 1/0007 (2013.01); G06T 7/0006 (2013.01); H04L 67/306 (2013.01); H04N 7/181 (2013.01); G06T 2207/10144 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing.


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