The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

May. 16, 2018
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Cheng-Hao Yang, Changhua County, TW;

En-Chiuan Liou, Tainan, TW;

Hsiao-Lin Hsu, Yunlin County, TW;

Tang-Chun Weng, Chiayi, TW;

Chia-Ching Lin, Kaohsiung, TW;

Yen-Pu Chen, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 27/02 (2006.01); H01L 21/66 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/30 (2013.01); H01L 21/3086 (2013.01); H01L 22/12 (2013.01); H01L 27/0207 (2013.01); H01L 29/66795 (2013.01);
Abstract

A method for monitoring fin removal includes providing a substrate having a first region with first fins extending along a first direction and a second region with second fins extending along a second direction, wherein the first direction is perpendicular to the second direction; forming a material layer on the substrate to cover the first fins and the second fins; identically patterning the first fins and the second fins using a first pattern and a second pattern respectively for simultaneously removing parts of the first and second fins, thereby forming first fin features in the first region and second fin features in the second region, wherein the first pattern has a first dimension along the second direction, the second pattern has a second dimension along the second direction, and the second dimension is equal to the first dimension; and monitoring the first fin features using the second fin features.


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