The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Apr. 27, 2016
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Govindarajan Thattaisundaram, San Jose, CA (US);

Hucheng Lee, Cupertino, CA (US);

Lisheng Gao, Morgan Hill, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01); G01N 21/95 (2006.01); G06T 7/00 (2017.01); G01N 21/956 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/95607 (2013.01); G06T 7/001 (2013.01); G01N 2021/8883 (2013.01); G01N 2021/95676 (2013.01); G01N 2201/0683 (2013.01); G01N 2201/06113 (2013.01); G01N 2201/10 (2013.01); G06T 2207/10056 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and systems for detecting defects on a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a pattern of interest (POI) within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for generating a POI reference image from two or more of the images generated at the multiple instances of the POI within the die. The computer subsystem(s) are further configured for comparing the images generated at the multiple instances of the POI within the die to the POI reference image and detecting defects in the multiple instances of the POI based on results of the comparing.


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