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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10385236 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Dec. 22, 2015

Use of a chemical mechanical polishing (cmp) composition for polishing of cobalt and / or cobalt alloy comprising substrates

Applicant:

Basf SE, Ludwigshafen, DE;

Inventors:

Robert Reichardt, Ludwigshafen am Rhein, DE;

Max Siebert, Ludwigshafen, DE;

Yongqing Lan, Ludwigshafen, DE;

Michael Lauter, Mannheim, DE;

Sheik Ansar Usman Ibrahim, Heverlee, BE;

Reza Golzarian, Portland, OR (US);

Haci Osman Guevenc, Heidelberg, DE;

Julian Proelss, Worms, DE;

Leonardus Leunissen, Ludwigshafen, DE;

Assignee:

BASF SE, Ludwigshafen, DE;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Stephanie P Duclair

Int. Cl.
CPC ...
H01L 21/461 (2006.01); C09G 1/02 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01); H01L 21/302 (2006.01); H01L 21/304 (2006.01); H01L 21/463 (2006.01); B24B 37/20 (2012.01); C09K 3/14 (2006.01); C23F 3/06 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/20 (2013.01); C09K 3/1409 (2013.01); C23F 3/06 (2013.01); H01L 21/302 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); H01L 21/32115 (2013.01); H01L 21/461 (2013.01); H01L 21/463 (2013.01); H01L 21/7684 (2013.01);
Abstract

A chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) containing (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) contains: (A) Inorganic particles, (B) a substituted aromatic compound with at least one carboxylic acid function as corrosion inhibitor, (C) at least one amino acid, (D) at least one oxidizer, (E) an aqueous medium, wherein the CMP composition (Q) has a pH of from 7 to 10.

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