The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Aug. 18, 2016
Applicant:

Kla-tencor Corporation, San Jose, CA (US);

Inventors:

Tao-Yi Fu, Fremont, CA (US);

Steve Lange, Alamo, CA (US);

Lisheng Gao, Morgan Hill, CA (US);

Xuguang Jiang, Santa Clara, CA (US);

Ping Gu, Milpitas, CA (US);

Sylvain Muckenhirn, Santa Barbara, CA (US);

Assignee:

KLA-Tencor Corp., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01); G01N 21/95 (2006.01); G01B 11/30 (2006.01); G01N 21/956 (2006.01); G01N 21/88 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01B 11/303 (2013.01); G01N 21/8806 (2013.01); G01N 21/956 (2013.01); H01L 22/12 (2013.01);
Abstract

Methods and systems for monitoring a non-defect related characteristic of a patterned wafer are provided. One computer-implemented method includes generating output responsive to light from a patterned wafer using an inspection system. The method also includes determining differences between a value of a non-defect related characteristic of the patterned wafer and a known value of the non-defect related characteristic based on differences between one or more attributes of the output and one or more attributes of other output of the inspection system for a different patterned wafer having the known value of the non-defect related characteristic.


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