The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Nov. 09, 2017
Applicant:
Tokyo Electron Limited, Minato-ku, Tokyo, JP;
Inventors:
Nihar Mohanty, Clifton Park, NY (US);
Elliott Franke, Albany, NY (US);
Richard Farrell, Nassau, NY (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/02118 (2013.01); H01L 21/02318 (2013.01); H01L 21/31111 (2013.01); H01L 21/31133 (2013.01); H01L 21/76802 (2013.01); H01L 21/76828 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01);
Abstract
A formed back-end-of-line (BEOL) metal line layer may include a plurality of metal lines with dielectric oxide caps that are disposed in between each metal lines. To overlay an interconnecting layer of metal lines on a selected metal line of the BEOL metal line layer, a block copolymer (BCP) may be formed on a patterning layer. Thereafter, a selective etching of the formed BCP creates a recess above the selected metal line. The created recess facilitates the overlaying of the interconnecting layer of metal lines.