The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Nov. 30, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Ming-Chang Wen, Kaohsiung, TW;

Chang-Yun Chang, Taipei, TW;

Hsien-Chin Lin, Hsinchu, TW;

Hung-Kai Chen, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/3215 (2006.01); H01L 21/3105 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 21/762 (2006.01); H01L 29/78 (2006.01); H01L 21/8258 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0214 (2013.01); H01L 21/02164 (2013.01); H01L 21/31056 (2013.01); H01L 21/32155 (2013.01); H01L 21/76224 (2013.01); H01L 21/8258 (2013.01); H01L 29/0649 (2013.01); H01L 29/66545 (2013.01); H01L 29/7848 (2013.01);
Abstract

A method includes providing a structure having a substrate and first and second fins over the substrate and oriented lengthwise generally along a first direction; epitaxially growing semiconductor source/drain (S/D) features over the first and second fins, wherein a first semiconductor S/D feature over the first fin merges with a second semiconductor S/D feature over the second fin; and performing a first etching process to an area between the first and second fins, wherein the first etching process separates the first and second semiconductor S/D features.


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