The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Mar. 26, 2018
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Cheng-Yen Tsai, New Taipei, TW;
Da-Yuan Lee, Jhubei, TW;
JoJo Lee, Hsinchu, TW;
Ming-Hsing Tsai, Chu-Pei, TW;
Hsueh Wen Tsau, Zhunan Township, TW;
Weng Chang, Hsinchu, TW;
Ying-Chieh Hung, Hsinchu, TW;
Yi-Hung Lin, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Various methods and structures formed by those methods are described. In accordance with a method, a first metal-containing layer is formed on a substrate. A second metal-containing layer is formed on the substrate. A material of the first metal-containing layer is different from a material of the second metal-containing layer. A chlorine-based treatment is performed on the first metal-containing layer and the second metal-containing layer. A third metal-containing layer is deposited on the first metal-containing layer and the second metal-containing layer using Atomic Layer Deposition (ALD).