The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Nov. 17, 2014
Applicants:

Spp Technologies Co., Ltd., Tokyo, JP;

Taiyo Nippon Sanso Corporation, Tokyo, JP;

Inventors:

Shoichi Murakami, Hyogo, JP;

Masayasu Hatashita, Hyogo, JP;

Hiroshi Taka, Tokyo, JP;

Masaya Yamawaki, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01B 21/06 (2006.01); C01B 21/068 (2006.01); C23C 16/34 (2006.01); H01L 21/02 (2006.01); C23C 16/505 (2006.01); C23C 16/509 (2006.01); C23C 16/511 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C01B 21/068 (2013.01); C23C 16/345 (2013.01); C23C 16/505 (2013.01); C23C 16/509 (2013.01); C23C 16/511 (2013.01); H01J 37/321 (2013.01); H01J 37/3244 (2013.01); H01J 37/32091 (2013.01); H01J 37/32192 (2013.01); H01L 21/0217 (2013.01); H01L 21/02211 (2013.01); H01L 21/02219 (2013.01); H01L 21/02274 (2013.01); H01J 2237/327 (2013.01); H01J 2237/3321 (2013.01);
Abstract

A method of reducing carbon and/or hydrogen atom content ratio relative to contents of silicon atoms and nitrogen atoms in a silicon nitride film formed by a plasma CVD method using an organic silane as a material, and improving film quality such as electrical properties. A silicon nitride film is formed with the organic silane and at least one additive gas selected from a group consisting of hydrogen and ammonia by a plasma CVD method. The silicon nitride film has a carbon atom content ratio of less than 0.8 assuming that a sum of a silicon atom content and a nitrogen atom content in the silicon nitride film is 1. The silicon nitride film has improved properties such as reduced leakage current.


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