The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Dec. 19, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Grant Kloster, Lake Oswego, OR (US);

Scott B. Clendenning, Portland, OR (US);

Rami Hourani, Portland, OR (US);

Szuya S. Liao, Portland, OR (US);

Patricio E. Romero, Portland, OR (US);

Florian Gstrein, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/51 (2006.01); H01L 29/423 (2006.01); H01L 21/28 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 29/06 (2006.01); H01L 29/786 (2006.01); H01L 21/32 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7851 (2013.01); H01L 21/0228 (2013.01); H01L 21/28194 (2013.01); H01L 21/3105 (2013.01); H01L 21/31058 (2013.01); H01L 21/31133 (2013.01); H01L 21/32 (2013.01); H01L 29/0649 (2013.01); H01L 29/0673 (2013.01); H01L 29/42368 (2013.01); H01L 29/42392 (2013.01); H01L 29/517 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/786 (2013.01); H01L 21/02178 (2013.01); H01L 21/02181 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01);
Abstract

Methods of selectively depositing high-K gate dielectric on a semiconductor structure are disclosed. The method includes providing a semiconductor structure disposed above a semiconductor substrate. The semiconductor structure is disposed beside an isolation sidewall. A sacrificial blocking layer is then selectively deposited on the isolation sidewall and not on the semiconductor structure. Thereafter, a high-K gate dielectric is deposited on the semiconductor structure, but not on the sacrificial blocking layer. Properties of the sacrificial blocking layer prevent deposition of oxide material on its surface. A thermal treatment is then performed to remove the sacrificial blocking layer, thereby forming a high-K gate dielectric only on the semiconductor structure.


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