The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Dec. 21, 2010
Dale R. Du Bois, Los Gatos, CA (US);
Mohamad A. Ayoub, Las Gatos, CA (US);
Robert Kim, Mountain View, CA (US);
Amit Bansal, Santa Clara, CA (US);
Mark Fodor, Los Gatos, CA (US);
Binh Nguyen, San Jose, CA (US);
Siu F. Cheng, Los Angeles, CA (US);
Hang Yu, Woodland, CA (US);
Chiu Chan, Foster City, CA (US);
Ganesh Balasubramanian, Sunnyvale, CA (US);
Deenesh Padhi, Sunnyvale, CA (US);
Juan Carlos Rocha, San Carlos, CA (US);
Dale R. Du Bois, Los Gatos, CA (US);
Mohamad A. Ayoub, Las Gatos, CA (US);
Robert Kim, Mountain View, CA (US);
Amit Bansal, Santa Clara, CA (US);
Mark Fodor, Los Gatos, CA (US);
Binh Nguyen, San Jose, CA (US);
Siu F. Cheng, Los Angeles, CA (US);
Hang Yu, Woodland, CA (US);
Chiu Chan, Foster City, CA (US);
Ganesh Balasubramanian, Sunnyvale, CA (US);
Deenesh Padhi, Sunnyvale, CA (US);
Juan Carlos Rocha, San Carlos, CA (US);
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Embodiments of the invention contemplate a shadow ring that provides increased or decreased and more uniform deposition on the edge of a wafer. By removing material from the top and/or bottom surfaces of the shadow ring, increased edge deposition and bevel coverage can be realized. In one embodiment, the material on the bottom surface is reduced by providing a recessed slot on the bottom surface. By increasing the amount of material of the shadow ring, the edge deposition and bevel coverage is reduced. Another approach to adjusting the deposition at the edge of the wafer includes increasing or decreasing the inner diameter of the shadow ring. The material forming the shadow ring may also be varied to change the amount of deposition at the edge of the wafer.