The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Jul. 24, 2015
Applicant:
Basf SE, Ludwigshafen, DE;
Inventors:
Yongqing Lan, Ludwigshafen, DE;
Bastian Marten Noller, Neuhofen, DE;
Liang Jiang, Beijing, CN;
Daniel Kwo-Hung Shen, Junghe, TW;
Reza Golzarian, Portland, OR (US);
Assignees:
ST. LAWRENCE NANOTECHNOLOGY, Norwood, NY (US);
BASF TAIWAN LTD., Taipei, TW;
BASF CORPORATION, Florham Park, NJ (US);
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/1436 (2013.01); H01L 21/3212 (2013.01);
Abstract
Described are a chemical-mechanical polishing (CMP) composition comprising abrasive particles in the form of organic/inorganic composite particles as well as the use of said composite particles as abrasive particles in a CMP composition and processes for the manufacture of a semiconductor device comprising chemical mechanical polishing of a substrate in the presence said CMP composition.