The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Dec. 22, 2015
Applicant:

Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);

Inventors:

Simon Ruffell, South Hamilton, MA (US);

Arvind Kumar, Manchester, MA (US);

Tristan Ma, Lexington, MA (US);

Kyu-Ha Shim, Andover, MA (US);

John Hautala, Beverly, MA (US);

Steven Sherman, Newton, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); H01L 27/108 (2006.01); H01L 21/265 (2006.01); H01L 21/28 (2006.01); H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 21/263 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10826 (2013.01); H01L 21/02238 (2013.01); H01L 21/02252 (2013.01); H01L 21/2633 (2013.01); H01L 21/26586 (2013.01); H01L 21/28167 (2013.01); H01L 27/10879 (2013.01); H01L 29/42368 (2013.01); H01L 21/26506 (2013.01);
Abstract

Provided herein are approaches for forming a gate oxide layer for a DRAM device, the method including providing a finned substrate having a recess formed therein, and performing an ion implant into a sidewall surface of the recess to form a gate oxide layer having a non-uniform thickness, wherein a thickness of the gate oxide layer at a top section of the sidewall surface is greater than a thickness of the gate oxide layer at a bottom section of the sidewall surface. In some approaches, the ion implant is provided as a series of ion implants at multiple different implant angles, varied along with an ion implantation energy and/or an ion dose to increase the thickness of the gate oxide of the top section of the sidewall surface. In some approaches, the finned substrate is also exposed to a plasma, either during or after, the ion implantation.


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