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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10204855 B1

PDFFull Text
Date of Patent:
Feb. 12, 2019

Filed:

Jul. 11, 2014

Bendable and stretchable electronic devices and methods

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Alejandro Levander, Santa Clara, CA (US);

Tatyana Andryushchenko, Beaverton, OR (US);

David Staines, Portland, OR (US);

Mauro Kobrinsky, Portland, OR (US);

Aleksandar Aleksov, Chandler, AZ (US);

Dilan Seneviratne, Phoenix, AZ (US);

Javier Soto Gonzalez, Chandler, AZ (US);

Srinivas Pietambaram, Gilbert, AZ (US);

Rafiqul Islam, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Mounir Amer

Assistant Examiner:

Alexander Belousov

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); B23B 5/16 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); B23B 5/16 (2013.01); B32B 27/08 (2013.01); B32B 27/283 (2013.01); H01L 21/4846 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3135 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 24/85 (2013.01); H01L 24/96 (2013.01); H01L 25/50 (2013.01); B32B 2307/54 (2013.01); B32B 2307/7265 (2013.01); B32B 2439/00 (2013.01); B32B 2457/00 (2013.01); H01L 24/48 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/85801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15791 (2013.01); H05K 1/0283 (2013.01);
Abstract

Generally discussed herein are systems and methods that can include a stretchable and bendable device. According to an example a method can include (1) depositing a first elastomer material on a panel, (2) laminating trace material on the elastomer material, (3) processing the trace material to pattern the trace material into one or more traces and one or more bond pads, (4) attaching a die to the one or more bond pads, or (5) depositing a second elastomer material on and around the one or more traces, the bonds pads, and the die to encapsulate the one or more traces and the one or more bond pads in the first and second elastomer materials.

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