The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Apr. 07, 2017
Mediatek Inc., Hsin-Chu, TW;
Nai-Wei Liu, Kaohsiung, TW;
Tzu-Hung Lin, Zhubei, TW;
I-Hsuan Peng, Hsinchu, TW;
Che-Hung Kuo, Tainan, TW;
Che-Ya Chou, Kaohsiung, TW;
Wei-Che Huang, Zhudong Township, Hsinchu County, TW;
MEDIATEK INC., Hsin-Chu, TW;
Abstract
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure. The RDL structure includes a conductive trace. A redistribution layer (RDL) contact pad is electrically coupled to the conductive trace. The RDL contact pad is composed of a symmetrical portion and an extended wing portion connected to the symmetrical portion. The extended wing portion overlaps at least one-half of a boundary of the symmetrical portion when observed from a plan view.