The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Jun. 29, 2017
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Hiroyuki Toshima, Yamanashi, JP;
Atsushi Shimada, Yamanashi, JP;
Tatsuo Hirasawa, Yamanashi, JP;
Tatsuo Hatano, Yamanashi, JP;
Shinji Furukawa, Yamanashi, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); H01L 23/532 (2006.01); C01G 23/00 (2006.01); C01G 41/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B32B 15/20 (2013.01); H01L 21/768 (2013.01); H01L 23/53238 (2013.01); C01G 23/00 (2013.01); C01G 41/00 (2013.01);
Abstract
A method for forming a copper film is provided. In the method, a base film that is a titanium nitride film, a tungsten film or a tungsten nitride film is formed along a surface of an insulating film of an object. A copper film is formed on the base film of the object cooled to a temperature of 209 K or less.