The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2019
Filed:
Jan. 17, 2017
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Jun Zhai, Cupertino, CA (US);
Chonghua Zhong, Cupertino, CA (US);
Kunzhong Hu, Cupertino, CA (US);
Se Young Yang, San Jose, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/18 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 21/768 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); G11C 14/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 21/76885 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/97 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); G11C 14/0018 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/1443 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Package on package structures and methods of manufacture are described. In various embodiments, DRAM die are integrated into various locations within a package on package structure, including within a bottom logic die package, as a co-package with a top NAND die package, and as a hybrid package structure between a top NAND die package and a bottom logic die package.