The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Feb. 16, 2017
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Wan-Te Chen, Taipei County, TW;
Chung-Hui Chen, Hsinchu, TW;
Chii-Ping Chen, Hsinchu, TW;
Chung-Yi Lin, Hsinchu County, TW;
Wen-Sheh Huang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 49/02 (2006.01); H01L 27/02 (2006.01); H01L 51/05 (2006.01); H01L 29/8605 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 28/20 (2013.01); H01L 27/0207 (2013.01); H01L 27/0802 (2013.01); H01L 28/00 (2013.01); H01L 29/8605 (2013.01); H01L 51/05 (2013.01);
Abstract
A semiconductor device is disclosed. The semiconductor device includes a first set of conductive layers coupled with an active device, a second set of conductive layers for connection to an external device, a set of intermediate conductive layers between the first set of conductive layers and the second set of conductive layers, and a resistive layer disposed in the set of intermediate conductive layers.