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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10163810 B1

PDFFull Text
Date of Patent:
Dec. 25, 2018

Filed:

Dec. 26, 2015

Electromagnetic interference shielding for system-in-package technology

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Eric J. Li, Chandler, AZ (US);

Yoshihiro Tomita, Tsukuba, JP;

Nachiket R. Raravikar, Gilbert, AZ (US);

Robert L. Sankman, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

Chuong A Ngo

Int. Cl.
CPC ...
H04M 1/02 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 21/311 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/31105 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/5386 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1815 (2013.01);
Abstract

Embodiments are generally directed to electromagnetic interference shielding for system-in-package technology. An embodiment of a system-in-package includes a substrate; chips and components attached to the substrate; dielectric molding over the chips and components; and an electromagnetic interference (EMI) shield. The EMI shield formed from a conductive paste, and the EMI shield provides a combined internal EMI shield between chips and components of the system in package and external EMI shield for the system-in-package.

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