The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Jun. 05, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

I-Chen Huang, Hsinchu, TW;

Kuang-Hsin Chen, Jung-Li, TW;

Yung-Hsien Wu, Hsinchu, TW;

Wen-Chao Shen, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/792 (2006.01); G11C 16/14 (2006.01); H01L 29/51 (2006.01); G11C 16/04 (2006.01); H01L 21/28 (2006.01); H01L 29/788 (2006.01); H01L 29/68 (2006.01);
U.S. Cl.
CPC ...
G11C 16/14 (2013.01); G11C 16/0466 (2013.01); H01L 21/28273 (2013.01); H01L 29/513 (2013.01); H01L 29/788 (2013.01); H01L 29/685 (2013.01);
Abstract

A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes a gate stack over the semiconductor substrate. The gate stack includes a first insulating layer, a charge trapping structure, a second insulating layer, and a gate electrode. The first insulating layer separates the semiconductor substrate from the charge trapping structure. The charge trapping structure is between the first insulating layer and the second insulating layer. The gate electrode is over the second insulating layer. The charge trapping structure includes a first layer and a second layer. The first layer includes zinc oxide, tin dioxide, titanium oxide, zinc tin oxide, indium oxide, indium zinc oxide, indium gallium zinc oxide, zinc oxynitride, tin oxynitride, titanium oxynitride, zinc tin oxynitride, indium oxynitride, indium zinc oxynitride, or indium gallium zinc oxynitride. The second layer includes nickel oxide, tin oxide, copper oxide, nickel oxynitride, tin oxynitride, or copper oxynitride. The semiconductor device structure includes a first doped region and a second doped region in the semiconductor substrate and on two opposite sides of the gate stack.


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