The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Jun. 20, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Jing-Cheng Lin, Hsinchu, TW;
Tsung-Fu Tsai, Changhua County, TW;
Chen-Hua Yu, Hsinchu, TW;
Po-Hao Tsai, Taoyuan, TW;
Shih-Ting Lin, Taipei, TW;
Szu-Wei Lu, Hsinchu, TW;
Hung-Wei Tsai, Changhua County, TW;
Chen-Hsuan Tsai, Taitung Cityan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes a first chip, a redistribution layer structure, a plurality of connection pads, a plurality of dummy patterns, a plurality of micro-bumps, a second chip and an underfill layer. The redistribution layer structure is electrically connected to the first chip. The connection pads are electrically connected to the redistribution layer structure. The dummy patterns are at one side of the connection pads. The micro-bumps are electrically connected to the connection pads. The second chip is electrically connected to the micro-bumps. The underfill layer covers the plurality of dummy patterns and surrounds the micro-bumps.