The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Nov. 21, 2016
Intel Corporation, Santa Clara, CA (US);
Howe Yin Loo, Sungai Petani, MY;
Eng Huat Goh, Penang, MY;
Min Suet Lim, Simpang Ampat, MY;
Bok Eng Cheah, Bukit Gambir, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Khang Choong Yong, Puchong, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
A system-in-package apparatus includes a package substrate configured to carry at least one semiconductive device on a die side and a through-mold via package bottom interposer disposed on the package substrate on a land side. A land side board mates with the through-mold via package bottom interposer, and enough vertical space is created by the through-mold via package bottom interposer to allow space for at least one device disposed on the package substrate on the land side.