The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

May. 14, 2015
Applicant:

Institute of Microelectronics, Chinese Academy of Sciences, Beijing, CN;

Inventors:

Qi Liu, Beijing, CN;

Ming Liu, Beijing, CN;

Haitao Sun, Beijing, CN;

Keke Zhang, Beijing, CN;

Shibing Long, Beijing, CN;

Hangbing Lv, Beijing, CN;

Writam Banerjee, Beijing, CN;

Kangwei Zhang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1246 (2013.01); H01L 45/08 (2013.01); H01L 45/085 (2013.01); H01L 45/1233 (2013.01); H01L 45/1266 (2013.01); H01L 45/142 (2013.01); H01L 45/143 (2013.01); H01L 45/146 (2013.01); H01L 45/16 (2013.01);
Abstract

A nonvolatile resistive switching memory, comprising an inert metal electrode, a resistive switching functional layer, and an easily oxidizable metal electrode, and characterized in that: a graphene barrier layer is inserted between the inert metal electrode and the resistive switching functional layer, which is capable of preventing the easily oxidizable metal ions from migrating into the inert metal electrode through the resistive switching functional layer under the action of electric field during the programming of the device. The manufacturing method therefore comprises adding a monolayer or multilayer graphene thin film between the inert electrode and the solid-state electrolyte resistive switching functional layer which services as a metal ion barrier layer to stop electrically-conductive metal filaments formed in the resistive switching layer from diffusing into the inert electrode layer during a RRAM device programming process, eliminating erroneous programming phenomenon occurring during the erasing process, improving device reliability.


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