The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Oct. 05, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ming-Jie Huang, Hsinchu, TW;

Syun-Ming Jang, Hsinchu, TW;

Ryan Chia-Jen Chen, Chiayi, TW;

Ming-Ching Chang, Hsinchu, TW;

Shu-Yuan Ku, Zhubei, TW;

Tai-Chun Huang, Hsinchu, TW;

Chunyao Wang, Zhubei, TW;

Tze-Liang Lee, Hsinchu, TW;

Chi On Chui, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01); H01L 21/28 (2006.01); H01L 29/78 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32053 (2013.01); H01L 21/28052 (2013.01); H01L 29/1033 (2013.01); H01L 29/4975 (2013.01); H01L 29/6681 (2013.01); H01L 29/66545 (2013.01); H01L 29/7856 (2013.01);
Abstract

A method includes forming a metal gate structure over a first fin, where the metal gate structure is surrounded by a first dielectric material, and forming a capping layer over the first dielectric material, where an etch selectivity between the metal gate structure and the capping layer is over a pre-determined threshold. The method also includes forming a patterned hard mask layer over the first fin and the first dielectric material, where an opening of the patterned hard mask layer exposes a portion of the metal gate structure and a portion of the capping layer. The method further includes removing the portion of the metal gate structure exposed by the opening of the patterned hard mask layer.


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