The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Jan. 30, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chun Hsiung Tsai, Xinpu Township, TW;
Chi-Yuan Shih, Zhubei, TW;
Gin-Chen Huang, New Taipei, TW;
Clement Hsingjen Wann, Carmel, NY (US);
Li-Chi Yu, Jhubei, TW;
Chin-Hsiang Lin, Hsin-Chu, TW;
Ling-Yen Yeh, Hsin-Chu, TW;
Meng-Chun Chang, Taipei, TW;
Neng-Kuo Chen, Hsin-Chu, TW;
Sey-Ping Sun, Hsin-Chu, TW;
Ta-Chun Ma, New Taipei, TW;
Yen-Chun Huang, New Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A device having an epitaxial region and dual metal-semiconductor alloy surfaces is provided. The epitaxial region includes an upward facing facet and a downward facing facet. The upward facing facet has a first metal-semiconductor alloy surface and the downward facing facet has a second metal-semiconductor alloy surface, wherein the first metal-semiconductor alloy is different than the second metal-semiconductor alloy.