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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10114288 B1

PDFFull Text
Date of Patent:
Oct. 30, 2018

Filed:

Sep. 01, 2016

Silicon-containing underlayers

Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Charlotte A. Cutler, Belingham, MA (US);

Suzanne M. Coley, Mansfield, MA (US);

Owendi Ongayi, Tarragona, ES;

Christopher P. Sullivan, Lakeville, MA (US);

Paul J. LaBeaume, Auburn, MA (US);

Li Cui, Westborough, MA (US);

Shintaro Yamada, Shrewsbury, MA (US);

Mingqi Li, Shrewsbury, MA (US);

James F. Cameron, Brookline, MA (US);

Assignee:

Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);

Attorney:

S. Matthew Cairns

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
G03F 7/11 (2006.01); G03F 7/075 (2006.01); C08F 20/14 (2006.01); C08F 20/28 (2006.01); C08F 20/32 (2006.01); C08F 24/00 (2006.01); C08G 67/00 (2006.01); C08G 73/12 (2006.01); C08G 77/04 (2006.01); C09D 5/20 (2006.01); C09D 183/04 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); G03F 7/42 (2006.01); C08F 20/10 (2006.01); C08F 220/14 (2006.01); C08F 220/20 (2006.01); C08F 220/24 (2006.01); C08F 222/06 (2006.01); C08F 222/40 (2006.01); C08F 230/08 (2006.01); C08F 220/18 (2006.01); C08F 220/28 (2006.01); C08F 220/32 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C08F 20/10 (2013.01); C08F 20/14 (2013.01); C08F 20/28 (2013.01); C08F 20/32 (2013.01); C08F 24/00 (2013.01); C08G 67/00 (2013.01); C08G 73/128 (2013.01); C08G 77/04 (2013.01); C09D 5/20 (2013.01); C09D 183/04 (2013.01); G03F 7/0752 (2013.01); G03F 7/161 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01); G03F 7/422 (2013.01); C08F 220/14 (2013.01); C08F 220/20 (2013.01); C08F 220/24 (2013.01); C08F 222/06 (2013.01); C08F 222/40 (2013.01); C08F 230/08 (2013.01); C08F 2220/1825 (2013.01); C08F 2220/1858 (2013.01); C08F 2220/1891 (2013.01); C08F 2220/282 (2013.01); C08F 2220/283 (2013.01); C08F 2220/325 (2013.01); C08F 2800/10 (2013.01);
Abstract

Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

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