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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10090163 B1

PDFFull Text
Date of Patent:
Oct. 02, 2018

Filed:

Aug. 24, 2015

Inorganic film-forming composition for multilayer resist processes, and pattern-forming method

Applicant:

Jsr Corporation, Tokyo, JP;

Inventors:

Hisashi Nakagawa, Tokyo, JP;

Tatsuya Sakai, Tokyo, JP;

Shunsuke Kurita, Tokyo, JP;

Satoshi Dei, Tokyo, JP;

Kazunori Takanashi, Tokyo, JP;

Yoshio Takimoto, Tokyo, JP;

Masayuki Motonari, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Sin J Lee

Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/033 (2006.01); G03F 7/11 (2006.01); G03F 7/09 (2006.01); G03F 7/36 (2006.01); G03F 7/32 (2006.01); G03F 7/20 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); C07F 13/00 (2006.01); C07F 11/00 (2006.01); C07F 9/00 (2006.01); C07F 7/28 (2006.01); C07F 5/06 (2006.01); C07F 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3081 (2013.01); C07F 5/00 (2013.01); C07F 5/003 (2013.01); C07F 5/06 (2013.01); C07F 7/28 (2013.01); C07F 9/00 (2013.01); C07F 11/00 (2013.01); C07F 13/00 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/0382 (2013.01); G03F 7/0392 (2013.01); G03F 7/09 (2013.01); G03F 7/094 (2013.01); G03F 7/11 (2013.01); G03F 7/2041 (2013.01); G03F 7/322 (2013.01); G03F 7/325 (2013.01); G03F 7/36 (2013.01); H01L 21/0332 (2013.01);
Abstract

An inorganic film-forming composition for multilayer resist processes includes a complex that includes: metal atoms; at least one bridging ligand; and a ligand which is other than the at least one bridging ligand and which is derived from a hydroxy acid ester, a β-diketone, a β-keto ester, a β-dicarboxylic acid ester or a combination thereof. The at least one bridging ligand includes a first bridging ligand derived from a compound represented by formula (1). An amount of the first bridging ligand is no less than 50 mol % with respect to a total of the bridging ligand. In the formula (1), Rrepresents an organic group having a valency of n. X represents —OH, —COOH, —NCO or —NHR, wherein Rrepresents a hydrogen atom or a monovalent organic group. n is an integer of 2 to 4.RX)  (1)

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