The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Jun. 23, 2017
Applicants:

United Microelectronics Corp., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian province, CN;

Inventors:

Chien-Hao Chen, Tainan, TW;

Chien-Wei Huang, Tainan, TW;

Chia-Hung Wang, Taichung, TW;

Sho-Shen Lee, New Taipei, TW;

Assignees:

UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian province, unknown;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/26 (2014.01);
U.S. Cl.
CPC ...
H01L 22/30 (2013.01); H01L 22/12 (2013.01);
Abstract

A semiconductor pattern for monitoring overlay and critical dimension at post-etching stage is provided in the present invention, which include a first inverted-T shaped pattern with a base portion and a middle portion extending from the base portion and a second pattern adjacent and spaced apart from the base portion of the first inverted-T shaped pattern, wherein the first inverted-T shaped pattern and the second pattern are composed of a plurality of spacer patterns spaced apart from each other.


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