The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Mar. 29, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Nilanjan Z. Ghosh, Chandler, AZ (US);

Kevin T. McCarthy, Tempe, AZ (US);

Zhiyong Wang, Chandler, AZ (US);

Deepak Goyal, Phoenix, AZ (US);

Changhua Liu, Chandler, AZ (US);

Leonel R. Arana, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 3/28 (2006.01); G01J 3/04 (2006.01); G01J 3/44 (2006.01); G02B 21/00 (2006.01); G01N 21/65 (2006.01); G01N 21/84 (2006.01); G01N 21/95 (2006.01); G01N 21/21 (2006.01);
U.S. Cl.
CPC ...
G02B 21/008 (2013.01); G01N 21/65 (2013.01); G01N 21/8422 (2013.01); G01N 21/9501 (2013.01); G02B 21/0064 (2013.01); G01J 3/44 (2013.01); G01N 21/21 (2013.01); G01N 2021/656 (2013.01);
Abstract

Embodiments include devices, systems and processes for using a combined confocal Raman microscope for inspecting a photo resist film material layer formed on the top surface of a layer of a substrate package, to detect border defects between regions of light exposed (e.g., cured) and unexposed (e.g., uncured) resist film material. Use of the confocal Raman microscope may provide a 3D photo-resist chemical imaging and characterization technique based on combining (1) Raman spectroscopy to identify the borders between regions of light exposed and unexposed resist along XY planes, with (2) Confocal imaging to select a Z-height of the XY planes scanned. Such detection provides fast, high resolution, non-destructive in-line inspection, and improves technical development of polymerization profiles of the resist film material.


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